Rama Innovation is an Indian organization engaged in trading and marketing of Pressure Sensitive Self-Adhesive Industrial Tapes, Die-Cuts, Liquid Adhesives, Industrial Abrasives, Packaging Materials, Printing Solutions and Flexographic Consumables.
Rama Innovation is an Indian organization engaged in trading and marketing of Pressure Sensitive Self-Adhesive Industrial Tapes, Die-Cuts, Liquid Adhesives, Industrial Abrasives, Packaging Materials, Printing Solutions and Flexographic Consumables.
RIFIX Thermal Conductive Tape is a pressure-sensitive adhesive tape designed to transfer heat between heat-generating components and heat sinks or other cooling surfaces while also providing mechanical bonding.
RIFIX Thermal Conductive Tape is a pressure-sensitive adhesive tape designed to transfer heat between heat-generating components and heat sinks or other cooling surfaces while also providing mechanical bonding. It is commonly used in electronics where screws or liquid thermal compounds are not practical.
A practical adhesive solution for applications that need both thermal transfer and mechanical attachment in a clean, compact format.
Helps transfer heat from generating components to heat sinks and cooling surfaces.
Combines thermal management and mechanical bonding in one product.
Can eliminate the need for screws or clips in many suitable applications.
Clean and mess-free compared with thermal paste or liquid thermal compounds.
Thermal Conductive Tape is suitable for electronics and electrical applications where reliable heat transfer and secure attachment are required.
Thermal management and heat sink attachment for LED lighting modules.
Attaches heat sinks while providing a thermal transfer path.
Suitable for CPUs, GPUs and memory module thermal applications.
Power supplies, transistors and MOSFET thermal management.
Battery packs and charging systems requiring thermal attachment.
Thermal management for telecommunications and automotive electronics.
Contact our team to discuss your heat transfer, heat sink attachment or electronics thermal management requirement.